Öffentliche Ausschreibung in Frankfurt

Bekanntmachung UVgO: Spice Modeling Support and Consulting Services.
Vergabenummer: Text freischaltenIHP-2024-044.
Bezeichnung Spice Modeling Support and Consulting Services.
Art der Vergabe Öffentliche Ausschreibung
Vergabe- und Vertragsordnung UVgO
Art des Auftrags Dienstleistung
Auftraggeber
Adresse der zur Angebotsabgabe auffordernden Stelle Text freischaltenIHP GmbH - Leibniz-Institut für innovative Mikroelektronik Kontaktstelle Beschaffung Zu Händen Text freischaltenFrau Sophie Rohner Im Technologiepark 25 15236 Frankfurt (Oder) TelefonText freischalten +49 335-5625-359 FaxText freischalten +49 335-5625-25359 E-Mail Text freischaltenrohner@ihp-microelectronics.com.
Adresse der den Zuschlag erteilenden Stelle: Siehe "zur Angebotsabgabe auffordernden Stelle".
Stelle, die die Vergabeunterlagen abgibt oder bei der sie eingesehen werden können: Siehe "zur Angebotsabgabe auffordernden Stelle".
Auftragsgegenstand
Leistungsbeschreibung
Art und Umfang der Leistung Tender for Spice Modeling Support and Consulting Services
Introduction:
Support and consulting on Spice modeling for active components within the IHP
technology portfolio (50 hours within a month)
Quantity: 6 month
IHP seeks to engage a service provider for support and consulting in the domain
of Spice modeling for active components within the IHP technology portfolio. IHP is
offering Multi-Project Wafer (MPW) prototyping services for BiCMOS technologies,
for both internal projects and external project partners. To efficiently utilize these
technologies, IHP develops a Process Design Kit (PDK) featuring Spice models of
all active and passive components available within the technology.
Objective:
The primary goal is to address the current shortage of experienced modeling
engineers at IHP by training three engineers in parameter extraction using the
Keysight EDA tool ICCAP. This training will include both theoretical and practical
aspects, with a specific focus on developing measurement and extraction strategies
for devices using available on-wafer measurement systems at IHP.
Scope of Work:

1. Training and Development:

- Conduct comprehensive training for three IHP engineers on parameter extraction
with ICCAP, covering both theory and practical applications.
- Develop and implement measurement and extraction strategies tailored to IHP
devices.
- Provide hands-on experience with on-wafer measurement systems at IHP facilities.

2. Support and Consulting:

- Offer ongoing support on extraction methodologies and verification of results.
- Assist in troubleshooting and refining extraction processes to ensure accuracy and efficiency.